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APDS-9008
Miniature Surface-Mount Ambient Light Photo Sensor
Data Sheet
Description
The APDS-9008 is a low cost analog-output ambient light photo sensor in miniature chipLED lead-free surface mount package. It consists of a spectrally suited photo sensor, which provides excellent responsivity that is close to the response of the human eyes, as show in figure 2. The APDS-9008 is ideal for applications in which the measurement of ambient light is used to control display backlighting. Mobile appliances such as the mobile phones and PDAs that draw heavy current from display backlighting will benefit from incorporating these photo sensor products in their designs by reducing power consumption significantly.
Features
* Excellent responsivity - Close responsivity to the human eye * Miniature ChipLED Leadfree surface-mount package Height - 0.55 mm Width - 1.60 mm Depth - 1.50 mm * Low sensitivity variation across various light sources * Operating temperature : -40C to 85C * Vcc supply 1.6 to 5.5V * Lead-free package, RoHS compliance * Output linearity across wide illumination range * High output saturation voltage
Application Support Information
The Application Engineering Group is available to assist you with the application design associated with APDS-9008 ambient light photo sensor module. You can contact them through your local sales representatives for additional details.
Applications
* Detection of ambient light to control display backlighting Mobile devices - Mobile phones, PDAs Computing devices - Notebooks, Webpads Consumer devices - TVs, Video Cameras, Digital Still Camera * Automatic Residential and Commercial Lighting Management * Electronic Signs and Signals
Ordering Information
Part Number
APDS-9008-020
Packaging Type
Tape and Reel
Package
6-pins Chipled package
Quantity
2500
Typical Application Circuit
VCC [1]
APDS-9008
OUT [6]
I/O Pins Configuration Table
Pin
1 GND [4] LOAD 2 3 4 5 Figure 1. Typical application circuit for APDS-9008 6
Symbol
VCC NC NC GND NC Iout
Description
VCC No Connect No Connect Ground No Connect Out
Absolute Maximum Ratings
For implementations where case to ambient thermal resistance is 50 C /W Parameter
Storage Temperature Supply Voltage
Symbol
TS VCC
Min.
-40 0
Max.
85 6
Units
C V
Recommended Operating Conditions
Parameter
Operating Temperature Supply Voltage
Symbol
TA VCC
Min.
-40 1.6
Max.
85 5.5
Units
C V
Conditions
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD. 2
Electrical & Optical Specifications (Ta=25C)
Parameter
Supply Current Photo Current (I) Photo Current (II) Dark Current Light Current Ratio Rise Time Fall Time Settling Time Peak sensitivity wavelength Propagation delay Storage delay Saturation voltage
Symbol
ICC I_PH1 I_PH2 I_DARK I_PH2/I_PH1 Tr Tf Tset Td Ts Vsat
Min.
28
Typ.
42 40 44 300 1.1 5 5 10 565 5 5
Max.
52
Units
A A A nA ms ms ms nm ms ms V
Conditions
Vcc =1.8V, Lux = 100 (2) Vcc =1.8V, Lux = 100 (2) Vcc =1.8V, Lux = 100 (1) Vcc =1.8V, Lux = 0 Incandescent light / Fluorescent light Rl = 1Kohm, Lux = 100 R1 = 1Kohm, Lux=100 R1=2.4Kohm,Lux=100 Rl = 1Kohm, Lux = 100 R1 = 1Kohm, Lux=100 R1 = 100Kohm, Lux = 100, Vcc=1.8V
1.5
Notes : 1. Illuminance by CIE standard light source (Incandescent lamp) 2. Fluorescence light is used as light source, however, white LED is substituted in a mass production process.
Light Measurement Circuit and Waveforms
I_pulse Pin 2,3,5: NC APDS-9008 Pin 6:Iout Pin 1:Vcc I_pulse
Pin 4: GND
Vout
Tr Td Vcc pulse from pulse generator Ts
Tf
Vcc
t Sensor output at load 90 %
Vout
t Tset Tset
3
1 0.8 Relative response 0.6 0.4 0.2 0 300 9008 Spectral response Eye Response Output Current [A]
450.0E-6 400.0E-6 350.0E-6 300.0E-6 250.0E-6 200.0E-6 150.0E-6 100.0E-6 50.0E-6 400 500 600 700 Wavelength in nm 800 900 1000 000.0E+0 0 100 200 300 400 500 600 700 800 900 1000 LUX
Figure 2. Relative Spectral Response Vs Wavelength
Figure 3. Average Iout Vs Lux (Vcc=1.8v, T=25C, White LED source)
1.40 1.20 1.00 Relative Iout Rel IOUT -20 0 20 40 60 Temperature in Degrees 80 100 0.80 0.60 0.40 0.20 0.00 -40
1.20 1.10 1.00 0.90 0.80 0.70 0.60 0.50 1.8 2.3 2.8 3.3 VCC Figure 5. Relative Iout Vs Vcc (T=25C, 100 Lux) 3.8 4.3 4.8 5.3
Figure 4. Relative Iout Vs Temp (Vcc=1.8v, 100 Lux)
1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0
1.40 1.20 1.00 REL AVG-ICC 0.80 0.60 0.40 0.20 -90 -70 -50 -30 -10 10 30 Angle in Degrees 50 70 90 0.00 -40 -20 0 REL Avg-ICC Vs TEMP at 100LUX 20 40 60 Temperature in Degrees 80 100
Figure 6. Relative Iout Vs Angle ( Vcc=1.8V, T=25C)
Relative Iout response
Figure 7. Relative Average Icc Vs Temp ( Vcc=1.8V, T=25C, 100 Lux)
4
1.20 1.10 1.00
Rel ICC
1.40E-06 1.20E-06 1.00E-06 IDark 8.00E-07 6.00E-07 4.00E-07 2.00E-07
0.90 0.80 0.70 0.60 0.50 1.8 2.3 2.8 3.3 VCC 3.8 4.3 4.8 5.3
0.00E+00 -40
-20
0
20 40 Temp in Degrees
60
80
100
Figure 8. Relative average Icc Vs Vcc (T=25C, 100 Lux)
Figure 9. Dark Current Vs Temp (Vcc=1.8V)
2.0 1.6
Vout (V)
R=12k R=10k R=8.2k R=6.8k R=4.7k R=1k 0 200 400 LUX 600 800 1000
1.2 0.8 0.4 0.0
Figure 10. General Luminance Vs Typical Output Voltage (Vcc=1.8V, T=25C, Light Source = White LED)
5
APDS-9008 Package Outline
6
APDS-9008 Tape and Reel Dimension
7
Moisture Proof Packaging
UNITS IN A SEALED MOISTURE-PROOF PACKAGE
PACKAGE IS OPENED (UNSEALED)
PARTS ARE NOT RECOMMENDED TO BE USED
NO
ENVIRONMENT LESS THAN 30 C AND LESS THAN 60%RH
YES
PACKAGE IS OPENED LESS THAN 168 HOURS
YES
NO BAKING IS NECESSARY
NO
NO
PACKAGE IS OPENED LESS THAN 15 DAYS
YES PERFORM RECOMMENDED BAKING CONDITIONS
All APDS-9008 options are shipped in moisture proof package. Once opened, moisture absorption begins. This part is compliant to JEDEC Level 3.
Recommended Storage Conditions:
Storage Temperature
Relative Humidity
100C to 300C
below 60% RH
Baking Conditions:
Package
In Reel In Bulk
Temperature
60C 100C
Time
48 hours 6 hours
Time from unsealing to soldering:
After removal from the bag, the parts should be soldered within 168 hours if stored at the recommended storage conditions. If times longer than 168 hours are needed, the parts must be stored in a dry box.
* Baking should only be done once.
8
Recommended Reflow Profile
255 T - TEMPERATURE (C) 230 217 200 180 150 120 80 25 0 P1 HEAT UP 50 100 P2 SOLDER PASTE DRY 150 200 P3 SOLDER REFLOW 250 P4 COOL DOWN 300 t-TIME (SECONDS)
MAX 260C
R3 R2 R1
R4
60 sec to 90 sec Above 217C
R5
Process Zone
Heat Up Solder Paste Dry Solder Reflow Cool Down Peak Temperature
Symbol
P1, R1 P2, R2 P3, R3 P3, R4 P4, R5
T
25C to 150C 150C to 200C 200C to 260C 260C to 200C 200C to 25C > 217C 260C >255C 25C to 260C
Maximum T/time or Duration
3C/s 100s to 180s 3C/s -6C/s -6C/s 60s to 120s 20s to 40s 8mins
Time maintained above liquidus point , 217C Time within 5C of actual Peak Temperature Time 25C to Peak Temperature
The reflow profile is a straight-line representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process zones, each with different T/time temperature change rates or duration. The T/time rates or duration are detailed in the above table. The temperatures are measured at the component to printed circuit board connections.
Process zone P1, the PC board and component pins are
heated to a temperature of 150C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 3C per second to allow for even heating of both the PC board and component pins.
solder to 260C (500F) for optimum results. The dwell time above the liquidus point of solder should be between 60 and 120 seconds. This is to assure proper coalescing of the solder paste into liquid solder and the formation of good solder connections. Beyond the recommended dwell time the intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder to allow the solder within the connections to freeze solid.
Process zone P4 is the cool down after solder freeze. The
Process zone P2 should be of sufficient time duration (100
to 180 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder.
cool down rate, R5, from the liquidus point of the solder to 25C (77F) should not exceed 6C per second maximum. This limitation is necessary to allow the PC board and component pins to change dimensions evenly, putting minimal stresses on the component. It is recommended to perform reflow soldering no more than twice.
Process zone P3 is the solder reflow zone. In zone P3, the
temperature is quickly raised above the liquidus point of
9
Appendix A. SMT Assembly Application Note
1.0 Solder Pad, Mask and Metal Stencil Aperture
Metal Stencil For Solder Paste Printing
1.2 Recommended Metal Solder Stencil Aperture
It is recommended that a 0.11 mm (0.004 inches) thick stencil be used for solder paste printing. Aperture opening for shield pad is 0.4mm x 0.4mm and 0.2mm x 0.4mm (as per land pattern). This is to ensure adequate printed solder paste volume and no shorting.
Stencil Aperture
Land Pattern Solder Mask PCBA
Aperture Opening 0.11 1.6 1.7 Unit: mm
Figure A1. Stencil and PCBA Figure A3. Solder Stencil Aperture
1.1 Recommended Land Pattern
CL 0.4 0.3
1.3 Adjacent Land Keepout and Solder Mask Areas
Adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern. There should be no other SMD components within this area. The minimum solder resist strip width required to avoid solder bridging adjacent pads is 0.2 mm. Note: Wet/Liquid Photo-Imageable solder resist/mask is recommended.
0.45 0.9
2.6
0.4
Mounting Center
2.7
0.2 Figure A2. Recommended Land Pattern
0.4
Unit: mm 0.2 MIN. Figure A4. Adjacent Land Keepout and Solder Mask Areas
10
Appendix B. Optical Window Design for APDS-9008
1.0 Optical Window Dimensions
To ensure that the performance of the APDS-9008 will not be affected by improper window design, there are some constraints on the dimensions and design of the window. There is a constraint on the minimum size of the window, which is placed in front of the photo light sensor, so that it will not affect the angular response of the APDS-9008. This minimum dimension that is recommended will ensure at least a 35 light reception cone. If a smaller window is required, a light pipe or light guide can be used. A light pipe or light guide is a cylindrical piece of transparent plastic, which makes use of total internal reflection to focus the light. The thickness of the window should be kept as minimum as possible because there is a loss of power in every optical window of about 8% due to reflection (4% on each side) and an additional loss of energy in the plastic material. Figure B1 and B2 illustrate the two types of window that we have recommended which could either be a flat window or a flat window with light pipe. Table 1 and Figure B3 below show the recommended dimensions of the window. These dimension values are based on a window thickness of 1.0mm with a refractive index 1.585.
D1 T Top View
WD
L
D2 D1
Z APDS-9008 Light Receving Area Figure B3. Recommended Window Dimensions
WD: Working Distance between window front panel & APDS-9008 D1: T: Window Diameter Thickness Length of Light Pipe Light Pipe Diameter Distance between window rear panel and APDS-9008
Flat
L: D2: Z:
Table 1. Recommended dimension for optical window
All dimensions are in mm
Figure B1. Window Size Determination for Flat Window
WD (T+L+Z)
1.5 2.0 2.5 3.0
Flat Window (L=0.0) Z
0.5 1.0 1.5 2.0
Flat window with Light Pipe (D2=1.5; Z =0.5) D1
2.5
D1
2.25 3.25 4.25 5.00
L
1.5
The window should be placed directly on top of the photo sensor to achieve better performance and if a flat window with a light pipe is used, dimension D2 should be 1.5mm to optimize the performance of APDS-9008.
Figure B2. Window Design of Flat Window with Light Guide
11
2.1 Optical Window Material
The material of the window is recommended to be polycarbonate. The surface finish of the plastic should be smooth, without any texture. The recommended plastic material for use as a window is available from Bayer AG and Bayer Antwerp N. V. (Europe), Bayer Corp.(USA) and Bayer Polymers Co., Ltd. (Thailand), as shown in Table 2. by the brightness of the light shone on the photo sensor and the load resistor used, RL. Increasing the brightness of the light or/and the load resistor will increase the output voltage. Brightness is measured as "LUX" unit, which describes how intense a light source that our eyes perceive. LUX meter is the equipment for "LUX" measurement. Light sources with the same LUX level appear at the same brightness to the human eyes.
Vcc Light Source 1 6 Vout A/D
Table 2. Recommended Plastic Materials
Material number
Makrolon LQ2647 Makrolon LQ3147 Makrolon LQ3187
Visible light transmission
87% 87% 85%
Refractive index
1.587 1.587 1.587
APDS-9003
Appendix C . General Application Guide for APDS-9008
The APDS-9008 is a low cost analog-output ambient light photo sensor whose spectral response closely emulates the human eyes. APDS-9008 consists of a photo sensor that is able to produce a high gain photo current to a sufficient level that can be converted to voltage with a standard value of external resistor. APDS-9008 can easily be integrated into systems that use ADC input which is available for sampling of the external source, as shown in figure C1 below. The amount of converted voltage, Vout, is mainly dependant proportionally on the photo current which generated
2,3,4,5 NC
C
RL
microcontroller
Figure C1: Configuration of APDS-9008
Selection of the load resistor RL will determine the amount of current-to-voltage conversion in the circuit. Light source e.g. fluorescent light consists of ac noise frequency of about 100Hz. A capacitor of 10uF, which act as a low-pass filter, is recommended to add in parallel with the load resistor to reduce the ripples.
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright (c) 2005-2008 Avago Technologies Limited. All rights reserved. AV02-1169EN - June 15, 2008

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